JPS5310659B2 - - Google Patents

Info

Publication number
JPS5310659B2
JPS5310659B2 JP9904072A JP9904072A JPS5310659B2 JP S5310659 B2 JPS5310659 B2 JP S5310659B2 JP 9904072 A JP9904072 A JP 9904072A JP 9904072 A JP9904072 A JP 9904072A JP S5310659 B2 JPS5310659 B2 JP S5310659B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9904072A
Other languages
Japanese (ja)
Other versions
JPS4957368A (sv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9904072A priority Critical patent/JPS5310659B2/ja
Publication of JPS4957368A publication Critical patent/JPS4957368A/ja
Publication of JPS5310659B2 publication Critical patent/JPS5310659B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9904072A 1972-10-04 1972-10-04 Expired JPS5310659B2 (sv)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9904072A JPS5310659B2 (sv) 1972-10-04 1972-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9904072A JPS5310659B2 (sv) 1972-10-04 1972-10-04

Publications (2)

Publication Number Publication Date
JPS4957368A JPS4957368A (sv) 1974-06-04
JPS5310659B2 true JPS5310659B2 (sv) 1978-04-15

Family

ID=14236332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9904072A Expired JPS5310659B2 (sv) 1972-10-04 1972-10-04

Country Status (1)

Country Link
JP (1) JPS5310659B2 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165568A (sv) * 1974-12-04 1976-06-07 Hitachi Ltd
JPS51107070A (sv) * 1975-03-18 1976-09-22 Fujitsu Ltd
JPS5315066A (en) * 1976-07-28 1978-02-10 Shinko Electric Ind Co Method of manufacturing electronic parts package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2041968A (en) * 1934-05-16 1936-05-26 Brown Co. Manufacture of rubber-reenforced waterlaid webs of fiber
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2041968A (en) * 1934-05-16 1936-05-26 Brown Co. Manufacture of rubber-reenforced waterlaid webs of fiber
US3230098A (en) * 1962-10-09 1966-01-18 Engelhard Ind Inc Immersion plating with noble metals

Also Published As

Publication number Publication date
JPS4957368A (sv) 1974-06-04

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