Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co LtdfiledCriticalToshiba Corp
Priority to JP1880577ApriorityCriticalpatent/JPS53104494A/en
Publication of JPS53104494ApublicationCriticalpatent/JPS53104494A/en
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices
(AREA)
Abstract
PURPOSE:To provide a lapping device capable of carrying out easily lapping with small irregularity in thickness without using diamond point and also carrying out easily one-side lapping in even SOS wafer or the like of high hardness.