JPS5310430Y2 - - Google Patents

Info

Publication number
JPS5310430Y2
JPS5310430Y2 JP1972052726U JP5272672U JPS5310430Y2 JP S5310430 Y2 JPS5310430 Y2 JP S5310430Y2 JP 1972052726 U JP1972052726 U JP 1972052726U JP 5272672 U JP5272672 U JP 5272672U JP S5310430 Y2 JPS5310430 Y2 JP S5310430Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1972052726U
Other languages
Japanese (ja)
Other versions
JPS4911031U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972052726U priority Critical patent/JPS5310430Y2/ja
Publication of JPS4911031U publication Critical patent/JPS4911031U/ja
Application granted granted Critical
Publication of JPS5310430Y2 publication Critical patent/JPS5310430Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP1972052726U 1972-05-08 1972-05-08 Expired JPS5310430Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972052726U JPS5310430Y2 (en:Method) 1972-05-08 1972-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972052726U JPS5310430Y2 (en:Method) 1972-05-08 1972-05-08

Publications (2)

Publication Number Publication Date
JPS4911031U JPS4911031U (en:Method) 1974-01-30
JPS5310430Y2 true JPS5310430Y2 (en:Method) 1978-03-20

Family

ID=27934570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972052726U Expired JPS5310430Y2 (en:Method) 1972-05-08 1972-05-08

Country Status (1)

Country Link
JP (1) JPS5310430Y2 (en:Method)

Also Published As

Publication number Publication date
JPS4911031U (en:Method) 1974-01-30

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