JPS5297166A - Method of producing thick multilayer circuit substrate - Google Patents
Method of producing thick multilayer circuit substrateInfo
- Publication number
- JPS5297166A JPS5297166A JP1415276A JP1415276A JPS5297166A JP S5297166 A JPS5297166 A JP S5297166A JP 1415276 A JP1415276 A JP 1415276A JP 1415276 A JP1415276 A JP 1415276A JP S5297166 A JPS5297166 A JP S5297166A
- Authority
- JP
- Japan
- Prior art keywords
- circuit substrate
- multilayer circuit
- producing thick
- thick multilayer
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1415276A JPS5297166A (en) | 1976-02-10 | 1976-02-10 | Method of producing thick multilayer circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1415276A JPS5297166A (en) | 1976-02-10 | 1976-02-10 | Method of producing thick multilayer circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5297166A true JPS5297166A (en) | 1977-08-15 |
JPS5758800B2 JPS5758800B2 (enrdf_load_stackoverflow) | 1982-12-11 |
Family
ID=11853168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1415276A Granted JPS5297166A (en) | 1976-02-10 | 1976-02-10 | Method of producing thick multilayer circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5297166A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157276A (en) * | 1978-06-01 | 1979-12-12 | Nippon Electric Co | Method of making thick film circuit pattern for microwave integrated circuit |
JPS5533063A (en) * | 1978-08-29 | 1980-03-08 | Nippon Electric Co | Method of manufacturing high packing density mounted substrate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4730136U (enrdf_load_stackoverflow) * | 1971-05-06 | 1972-12-05 | ||
JPS4945909A (enrdf_load_stackoverflow) * | 1972-08-04 | 1974-05-02 |
-
1976
- 1976-02-10 JP JP1415276A patent/JPS5297166A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4730136U (enrdf_load_stackoverflow) * | 1971-05-06 | 1972-12-05 | ||
JPS4945909A (enrdf_load_stackoverflow) * | 1972-08-04 | 1974-05-02 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54157276A (en) * | 1978-06-01 | 1979-12-12 | Nippon Electric Co | Method of making thick film circuit pattern for microwave integrated circuit |
JPS5533063A (en) * | 1978-08-29 | 1980-03-08 | Nippon Electric Co | Method of manufacturing high packing density mounted substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS5758800B2 (enrdf_load_stackoverflow) | 1982-12-11 |
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