JPS5297063U - - Google Patents
Info
- Publication number
- JPS5297063U JPS5297063U JP1976003663U JP366376U JPS5297063U JP S5297063 U JPS5297063 U JP S5297063U JP 1976003663 U JP1976003663 U JP 1976003663U JP 366376 U JP366376 U JP 366376U JP S5297063 U JPS5297063 U JP S5297063U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976003663U JPS5644034Y2 (en) | 1976-01-17 | 1976-01-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1976003663U JPS5644034Y2 (en) | 1976-01-17 | 1976-01-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5297063U true JPS5297063U (en) | 1977-07-20 |
JPS5644034Y2 JPS5644034Y2 (en) | 1981-10-15 |
Family
ID=28464324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1976003663U Expired JPS5644034Y2 (en) | 1976-01-17 | 1976-01-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5644034Y2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4985046U (en) * | 1972-11-10 | 1974-07-23 | ||
JPS49149671U (en) * | 1973-04-27 | 1974-12-25 | ||
JPS5080767A (en) * | 1973-11-14 | 1975-07-01 |
-
1976
- 1976-01-17 JP JP1976003663U patent/JPS5644034Y2/ja not_active Expired
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4985046U (en) * | 1972-11-10 | 1974-07-23 | ||
JPS49149671U (en) * | 1973-04-27 | 1974-12-25 | ||
JPS5080767A (en) * | 1973-11-14 | 1975-07-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS5644034Y2 (en) | 1981-10-15 |