JPS5297063U - - Google Patents

Info

Publication number
JPS5297063U
JPS5297063U JP1976003663U JP366376U JPS5297063U JP S5297063 U JPS5297063 U JP S5297063U JP 1976003663 U JP1976003663 U JP 1976003663U JP 366376 U JP366376 U JP 366376U JP S5297063 U JPS5297063 U JP S5297063U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976003663U
Other languages
Japanese (ja)
Other versions
JPS5644034Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976003663U priority Critical patent/JPS5644034Y2/ja
Publication of JPS5297063U publication Critical patent/JPS5297063U/ja
Application granted granted Critical
Publication of JPS5644034Y2 publication Critical patent/JPS5644034Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1976003663U 1976-01-17 1976-01-17 Expired JPS5644034Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976003663U JPS5644034Y2 (en) 1976-01-17 1976-01-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976003663U JPS5644034Y2 (en) 1976-01-17 1976-01-17

Publications (2)

Publication Number Publication Date
JPS5297063U true JPS5297063U (en) 1977-07-20
JPS5644034Y2 JPS5644034Y2 (en) 1981-10-15

Family

ID=28464324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976003663U Expired JPS5644034Y2 (en) 1976-01-17 1976-01-17

Country Status (1)

Country Link
JP (1) JPS5644034Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985046U (en) * 1972-11-10 1974-07-23
JPS49149671U (en) * 1973-04-27 1974-12-25
JPS5080767A (en) * 1973-11-14 1975-07-01

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4985046U (en) * 1972-11-10 1974-07-23
JPS49149671U (en) * 1973-04-27 1974-12-25
JPS5080767A (en) * 1973-11-14 1975-07-01

Also Published As

Publication number Publication date
JPS5644034Y2 (en) 1981-10-15

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