JPS5294371U - - Google Patents
Info
- Publication number
- JPS5294371U JPS5294371U JP1976001927U JP192776U JPS5294371U JP S5294371 U JPS5294371 U JP S5294371U JP 1976001927 U JP1976001927 U JP 1976001927U JP 192776 U JP192776 U JP 192776U JP S5294371 U JPS5294371 U JP S5294371U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976001927U JPS5294371U (en) | 1976-01-12 | 1976-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976001927U JPS5294371U (en) | 1976-01-12 | 1976-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5294371U true JPS5294371U (en) | 1977-07-14 |
Family
ID=28462581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976001927U Pending JPS5294371U (en) | 1976-01-12 | 1976-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5294371U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05190595A (en) * | 1992-01-09 | 1993-07-30 | Fujitsu Ltd | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4823961U (en) * | 1971-07-26 | 1973-03-19 |
-
1976
- 1976-01-12 JP JP1976001927U patent/JPS5294371U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4823961U (en) * | 1971-07-26 | 1973-03-19 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05190595A (en) * | 1992-01-09 | 1993-07-30 | Fujitsu Ltd | Semiconductor device |