JPS5291446U - - Google Patents
Info
- Publication number
- JPS5291446U JPS5291446U JP18010675U JP18010675U JPS5291446U JP S5291446 U JPS5291446 U JP S5291446U JP 18010675 U JP18010675 U JP 18010675U JP 18010675 U JP18010675 U JP 18010675U JP S5291446 U JPS5291446 U JP S5291446U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18010675U JPS5291446U (fr) | 1975-12-29 | 1975-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18010675U JPS5291446U (fr) | 1975-12-29 | 1975-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5291446U true JPS5291446U (fr) | 1977-07-08 |
Family
ID=28658326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18010675U Pending JPS5291446U (fr) | 1975-12-29 | 1975-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5291446U (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014110480A3 (fr) * | 2013-01-11 | 2014-09-04 | Qualcomm Incorporated | Conception de diplexeur utilisant une technologie de trou de liaison à travers du verre |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9935166B2 (en) | 2013-03-15 | 2018-04-03 | Qualcomm Incorporated | Capacitor with a dielectric between a via and a plate of the capacitor |
| JP2018182283A (ja) * | 2017-04-07 | 2018-11-15 | 大日本印刷株式会社 | キャパシタ内蔵部品及びキャパシタ内蔵部品を備える実装基板並びにキャパシタ内蔵部品の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495024U (fr) * | 1972-04-13 | 1974-01-17 |
-
1975
- 1975-12-29 JP JP18010675U patent/JPS5291446U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS495024U (fr) * | 1972-04-13 | 1974-01-17 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014110480A3 (fr) * | 2013-01-11 | 2014-09-04 | Qualcomm Incorporated | Conception de diplexeur utilisant une technologie de trou de liaison à travers du verre |
| US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
| US9935166B2 (en) | 2013-03-15 | 2018-04-03 | Qualcomm Incorporated | Capacitor with a dielectric between a via and a plate of the capacitor |
| US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9813043B2 (en) | 2013-05-06 | 2017-11-07 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
| US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
| JP2018182283A (ja) * | 2017-04-07 | 2018-11-15 | 大日本印刷株式会社 | キャパシタ内蔵部品及びキャパシタ内蔵部品を備える実装基板並びにキャパシタ内蔵部品の製造方法 |
| JP2022028847A (ja) * | 2017-04-07 | 2022-02-16 | 大日本印刷株式会社 | キャパシタ内蔵部品及びキャパシタ内蔵部品を備える実装基板並びにキャパシタ内蔵部品の製造方法 |