JPS5288570U - - Google Patents
Info
- Publication number
- JPS5288570U JPS5288570U JP1975179150U JP17915075U JPS5288570U JP S5288570 U JPS5288570 U JP S5288570U JP 1975179150 U JP1975179150 U JP 1975179150U JP 17915075 U JP17915075 U JP 17915075U JP S5288570 U JPS5288570 U JP S5288570U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975179150U JPS5542448Y2 (en:Method) | 1975-12-25 | 1975-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975179150U JPS5542448Y2 (en:Method) | 1975-12-25 | 1975-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5288570U true JPS5288570U (en:Method) | 1977-07-01 |
| JPS5542448Y2 JPS5542448Y2 (en:Method) | 1980-10-04 |
Family
ID=28657423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975179150U Expired JPS5542448Y2 (en:Method) | 1975-12-25 | 1975-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5542448Y2 (en:Method) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945447U (en:Method) * | 1972-07-25 | 1974-04-20 | ||
| JPS4947146U (en:Method) * | 1972-07-31 | 1974-04-25 | ||
| JPS50102164A (en:Method) * | 1974-01-17 | 1975-08-13 |
-
1975
- 1975-12-25 JP JP1975179150U patent/JPS5542448Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4945447U (en:Method) * | 1972-07-25 | 1974-04-20 | ||
| JPS4947146U (en:Method) * | 1972-07-31 | 1974-04-25 | ||
| JPS50102164A (en:Method) * | 1974-01-17 | 1975-08-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5542448Y2 (en:Method) | 1980-10-04 |