JPS5288570U - - Google Patents

Info

Publication number
JPS5288570U
JPS5288570U JP17915075U JP17915075U JPS5288570U JP S5288570 U JPS5288570 U JP S5288570U JP 17915075 U JP17915075 U JP 17915075U JP 17915075 U JP17915075 U JP 17915075U JP S5288570 U JPS5288570 U JP S5288570U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17915075U
Other languages
Japanese (ja)
Other versions
JPS5542448Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975179150U priority Critical patent/JPS5542448Y2/ja
Publication of JPS5288570U publication Critical patent/JPS5288570U/ja
Application granted granted Critical
Publication of JPS5542448Y2 publication Critical patent/JPS5542448Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1975179150U 1975-12-25 1975-12-25 Expired JPS5542448Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975179150U JPS5542448Y2 (enrdf_load_html_response) 1975-12-25 1975-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975179150U JPS5542448Y2 (enrdf_load_html_response) 1975-12-25 1975-12-25

Publications (2)

Publication Number Publication Date
JPS5288570U true JPS5288570U (enrdf_load_html_response) 1977-07-01
JPS5542448Y2 JPS5542448Y2 (enrdf_load_html_response) 1980-10-04

Family

ID=28657423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975179150U Expired JPS5542448Y2 (enrdf_load_html_response) 1975-12-25 1975-12-25

Country Status (1)

Country Link
JP (1) JPS5542448Y2 (enrdf_load_html_response)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945447U (enrdf_load_html_response) * 1972-07-25 1974-04-20
JPS4947146U (enrdf_load_html_response) * 1972-07-31 1974-04-25
JPS50102164A (enrdf_load_html_response) * 1974-01-17 1975-08-13

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945447U (enrdf_load_html_response) * 1972-07-25 1974-04-20
JPS4947146U (enrdf_load_html_response) * 1972-07-31 1974-04-25
JPS50102164A (enrdf_load_html_response) * 1974-01-17 1975-08-13

Also Published As

Publication number Publication date
JPS5542448Y2 (enrdf_load_html_response) 1980-10-04

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