JPS52849A - Apparatus for molding - Google Patents
Apparatus for moldingInfo
- Publication number
- JPS52849A JPS52849A JP7670775A JP7670775A JPS52849A JP S52849 A JPS52849 A JP S52849A JP 7670775 A JP7670775 A JP 7670775A JP 7670775 A JP7670775 A JP 7670775A JP S52849 A JPS52849 A JP S52849A
- Authority
- JP
- Japan
- Prior art keywords
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7670775A JPS52849A (en) | 1975-06-24 | 1975-06-24 | Apparatus for molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7670775A JPS52849A (en) | 1975-06-24 | 1975-06-24 | Apparatus for molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52849A true JPS52849A (en) | 1977-01-06 |
Family
ID=13612984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7670775A Pending JPS52849A (en) | 1975-06-24 | 1975-06-24 | Apparatus for molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52849A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0559838U (en) * | 1992-01-20 | 1993-08-06 | 株式会社三井ハイテック | Resin encapsulation mold for semiconductor devices |
-
1975
- 1975-06-24 JP JP7670775A patent/JPS52849A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0559838U (en) * | 1992-01-20 | 1993-08-06 | 株式会社三井ハイテック | Resin encapsulation mold for semiconductor devices |
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