JPS5283671U - - Google Patents

Info

Publication number
JPS5283671U
JPS5283671U JP1975171559U JP17155975U JPS5283671U JP S5283671 U JPS5283671 U JP S5283671U JP 1975171559 U JP1975171559 U JP 1975171559U JP 17155975 U JP17155975 U JP 17155975U JP S5283671 U JPS5283671 U JP S5283671U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975171559U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975171559U priority Critical patent/JPS5283671U/ja
Publication of JPS5283671U publication Critical patent/JPS5283671U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1975171559U 1975-12-18 1975-12-18 Pending JPS5283671U (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975171559U JPS5283671U (https=) 1975-12-18 1975-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975171559U JPS5283671U (https=) 1975-12-18 1975-12-18

Publications (1)

Publication Number Publication Date
JPS5283671U true JPS5283671U (https=) 1977-06-22

Family

ID=28650018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975171559U Pending JPS5283671U (https=) 1975-12-18 1975-12-18

Country Status (1)

Country Link
JP (1) JPS5283671U (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881B1 (https=) * 1970-07-31 1974-03-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4912881B1 (https=) * 1970-07-31 1974-03-28

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