JPS5283172A - Apparatus for ultrasonic bonding wires - Google Patents

Apparatus for ultrasonic bonding wires

Info

Publication number
JPS5283172A
JPS5283172A JP15849875A JP15849875A JPS5283172A JP S5283172 A JPS5283172 A JP S5283172A JP 15849875 A JP15849875 A JP 15849875A JP 15849875 A JP15849875 A JP 15849875A JP S5283172 A JPS5283172 A JP S5283172A
Authority
JP
Japan
Prior art keywords
bonding wires
ultrasonic bonding
ultrasonic
wires
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15849875A
Other languages
English (en)
Japanese (ja)
Other versions
JPS556296B2 (enExample
Inventor
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP15849875A priority Critical patent/JPS5283172A/ja
Publication of JPS5283172A publication Critical patent/JPS5283172A/ja
Publication of JPS556296B2 publication Critical patent/JPS556296B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/075—
    • H10W72/07502—
    • H10W72/07533—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP15849875A 1975-12-31 1975-12-31 Apparatus for ultrasonic bonding wires Granted JPS5283172A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15849875A JPS5283172A (en) 1975-12-31 1975-12-31 Apparatus for ultrasonic bonding wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15849875A JPS5283172A (en) 1975-12-31 1975-12-31 Apparatus for ultrasonic bonding wires

Publications (2)

Publication Number Publication Date
JPS5283172A true JPS5283172A (en) 1977-07-11
JPS556296B2 JPS556296B2 (enExample) 1980-02-15

Family

ID=15673039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15849875A Granted JPS5283172A (en) 1975-12-31 1975-12-31 Apparatus for ultrasonic bonding wires

Country Status (1)

Country Link
JP (1) JPS5283172A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928822A (enExample) * 1972-07-12 1974-03-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928822A (enExample) * 1972-07-12 1974-03-14

Also Published As

Publication number Publication date
JPS556296B2 (enExample) 1980-02-15

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