JPS5283170A - Apparatus for supersonic wire bonding - Google Patents

Apparatus for supersonic wire bonding

Info

Publication number
JPS5283170A
JPS5283170A JP15849675A JP15849675A JPS5283170A JP S5283170 A JPS5283170 A JP S5283170A JP 15849675 A JP15849675 A JP 15849675A JP 15849675 A JP15849675 A JP 15849675A JP S5283170 A JPS5283170 A JP S5283170A
Authority
JP
Japan
Prior art keywords
wire bonding
supersonic
supersonic wire
bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15849675A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5548453B2 (ref
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP15849675A priority Critical patent/JPS5283170A/ja
Publication of JPS5283170A publication Critical patent/JPS5283170A/ja
Publication of JPS5548453B2 publication Critical patent/JPS5548453B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP15849675A 1975-12-31 1975-12-31 Apparatus for supersonic wire bonding Granted JPS5283170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15849675A JPS5283170A (en) 1975-12-31 1975-12-31 Apparatus for supersonic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15849675A JPS5283170A (en) 1975-12-31 1975-12-31 Apparatus for supersonic wire bonding

Publications (2)

Publication Number Publication Date
JPS5283170A true JPS5283170A (en) 1977-07-11
JPS5548453B2 JPS5548453B2 (ref) 1980-12-05

Family

ID=15672996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15849675A Granted JPS5283170A (en) 1975-12-31 1975-12-31 Apparatus for supersonic wire bonding

Country Status (1)

Country Link
JP (1) JPS5283170A (ref)

Also Published As

Publication number Publication date
JPS5548453B2 (ref) 1980-12-05

Similar Documents

Publication Publication Date Title
JPS5293A (en) Supersonic medical apparatus
JPS51139357A (en) Supersonic transducer
GB2051411B (en) Wire bonding apparatus
JPS5324961A (en) Apparatus for holding moving wire
MY7900224A (en) Wire bonding apparatus
GB1524462A (en) Wire bonding apparartus
GB1556172A (en) Wire bonding unit
JPS51122596A (en) Device for tying wires
ZA762530B (en) Wire drawing
JPS5257987A (en) Apparatus for feeding wire
JPS51146350A (en) Ultrasonic wire bonding device
JPS51122265A (en) Device for separating wires
JPS52128796A (en) Bonding apparatus
JPS52749A (en) Ultrasonic soldering method
JPS5283169A (en) Apparatus for supersonic wire bonding
JPS5284673A (en) Deflecting apparatus
JPS527841A (en) Welding device
JPS5276690A (en) Insurated wire
JPS5283171A (en) Apparatus for supersonic wire bonding
JPS5283168A (en) Apparatus for supersonic wire bonding
JPS51126351A (en) Welding wire
JPS51131751A (en) Apparatus for bonding material
JPS5282075A (en) Apparatus for wire bonding
JPS528942A (en) Welding wire
GB1555978A (en) Feed apparatus