JPS5279864U - - Google Patents
Info
- Publication number
- JPS5279864U JPS5279864U JP1975167587U JP16758775U JPS5279864U JP S5279864 U JPS5279864 U JP S5279864U JP 1975167587 U JP1975167587 U JP 1975167587U JP 16758775 U JP16758775 U JP 16758775U JP S5279864 U JPS5279864 U JP S5279864U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975167587U JPS5279864U (enExample) | 1975-12-11 | 1975-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975167587U JPS5279864U (enExample) | 1975-12-11 | 1975-12-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5279864U true JPS5279864U (enExample) | 1977-06-14 |
Family
ID=28646205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975167587U Pending JPS5279864U (enExample) | 1975-12-11 | 1975-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5279864U (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887776A (enExample) * | 1972-02-18 | 1973-11-17 |
-
1975
- 1975-12-11 JP JP1975167587U patent/JPS5279864U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4887776A (enExample) * | 1972-02-18 | 1973-11-17 |