JPS5276270U - - Google Patents

Info

Publication number
JPS5276270U
JPS5276270U JP1975164574U JP16457475U JPS5276270U JP S5276270 U JPS5276270 U JP S5276270U JP 1975164574 U JP1975164574 U JP 1975164574U JP 16457475 U JP16457475 U JP 16457475U JP S5276270 U JPS5276270 U JP S5276270U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1975164574U
Other languages
Japanese (ja)
Other versions
JPS5729319Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975164574U priority Critical patent/JPS5729319Y2/ja
Publication of JPS5276270U publication Critical patent/JPS5276270U/ja
Application granted granted Critical
Publication of JPS5729319Y2 publication Critical patent/JPS5729319Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1975164574U 1975-12-04 1975-12-04 Expired JPS5729319Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975164574U JPS5729319Y2 (https=) 1975-12-04 1975-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975164574U JPS5729319Y2 (https=) 1975-12-04 1975-12-04

Publications (2)

Publication Number Publication Date
JPS5276270U true JPS5276270U (https=) 1977-06-07
JPS5729319Y2 JPS5729319Y2 (https=) 1982-06-26

Family

ID=28643348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975164574U Expired JPS5729319Y2 (https=) 1975-12-04 1975-12-04

Country Status (1)

Country Link
JP (1) JPS5729319Y2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193239U (https=) * 1981-06-03 1982-12-07

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (https=) * 1972-07-19 1974-03-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (https=) * 1972-07-19 1974-03-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193239U (https=) * 1981-06-03 1982-12-07

Also Published As

Publication number Publication date
JPS5729319Y2 (https=) 1982-06-26

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