JPS5276270U - - Google Patents

Info

Publication number
JPS5276270U
JPS5276270U JP1975164574U JP16457475U JPS5276270U JP S5276270 U JPS5276270 U JP S5276270U JP 1975164574 U JP1975164574 U JP 1975164574U JP 16457475 U JP16457475 U JP 16457475U JP S5276270 U JPS5276270 U JP S5276270U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1975164574U
Other languages
Japanese (ja)
Other versions
JPS5729319Y2 (enFirst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975164574U priority Critical patent/JPS5729319Y2/ja
Publication of JPS5276270U publication Critical patent/JPS5276270U/ja
Application granted granted Critical
Publication of JPS5729319Y2 publication Critical patent/JPS5729319Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1975164574U 1975-12-04 1975-12-04 Expired JPS5729319Y2 (enFirst)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975164574U JPS5729319Y2 (enFirst) 1975-12-04 1975-12-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975164574U JPS5729319Y2 (enFirst) 1975-12-04 1975-12-04

Publications (2)

Publication Number Publication Date
JPS5276270U true JPS5276270U (enFirst) 1977-06-07
JPS5729319Y2 JPS5729319Y2 (enFirst) 1982-06-26

Family

ID=28643348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975164574U Expired JPS5729319Y2 (enFirst) 1975-12-04 1975-12-04

Country Status (1)

Country Link
JP (1) JPS5729319Y2 (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193239U (enFirst) * 1981-06-03 1982-12-07

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (enFirst) * 1972-07-19 1974-03-16

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929974A (enFirst) * 1972-07-19 1974-03-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57193239U (enFirst) * 1981-06-03 1982-12-07

Also Published As

Publication number Publication date
JPS5729319Y2 (enFirst) 1982-06-26

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