JPS5275983A - Device for applying dielectric layer employing glow discharge - Google Patents

Device for applying dielectric layer employing glow discharge

Info

Publication number
JPS5275983A
JPS5275983A JP51148800A JP14880076A JPS5275983A JP S5275983 A JPS5275983 A JP S5275983A JP 51148800 A JP51148800 A JP 51148800A JP 14880076 A JP14880076 A JP 14880076A JP S5275983 A JPS5275983 A JP S5275983A
Authority
JP
Japan
Prior art keywords
dielectric layer
glow discharge
layer employing
applying dielectric
employing glow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51148800A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5433956B2 (Direct
Inventor
Jiyakobu Ateiiru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LFE Corp
Original Assignee
LFE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LFE Corp filed Critical LFE Corp
Publication of JPS5275983A publication Critical patent/JPS5275983A/ja
Publication of JPS5433956B2 publication Critical patent/JPS5433956B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/507Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Formation Of Insulating Films (AREA)
  • Chemical Vapour Deposition (AREA)
JP51148800A 1975-12-17 1976-12-13 Device for applying dielectric layer employing glow discharge Granted JPS5275983A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/641,441 US4066037A (en) 1975-12-17 1975-12-17 Apparatus for depositing dielectric films using a glow discharge

Publications (2)

Publication Number Publication Date
JPS5275983A true JPS5275983A (en) 1977-06-25
JPS5433956B2 JPS5433956B2 (Direct) 1979-10-24

Family

ID=24572394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51148800A Granted JPS5275983A (en) 1975-12-17 1976-12-13 Device for applying dielectric layer employing glow discharge

Country Status (4)

Country Link
US (1) US4066037A (Direct)
JP (1) JPS5275983A (Direct)
DE (1) DE2656821A1 (Direct)
GB (1) GB1533497A (Direct)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54160568A (en) * 1978-06-09 1979-12-19 Anelva Corp Thin film forming equipment for discharge chemical reaction
JPS5595334A (en) * 1979-01-10 1980-07-19 Nec Corp Preparation of semiconductor device
JPS609180A (ja) * 1983-06-13 1985-01-18 アメリカン・テレフオン・アンド・テレグラフ・カムパニ− 半導体光検出器の製作方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4264393A (en) * 1977-10-31 1981-04-28 Motorola, Inc. Reactor apparatus for plasma etching or deposition
US5187115A (en) 1977-12-05 1993-02-16 Plasma Physics Corp. Method of forming semiconducting materials and barriers using a dual enclosure apparatus
FR2411897A2 (fr) * 1977-12-13 1979-07-13 Alsthom Atlantique Procede de depot d'une couche mince par decomposition d'un gaz dans un plasma
EP0072603B1 (en) * 1978-06-14 1986-10-01 Fujitsu Limited Process for producing a semiconductor device having an insulating layer of silicon dioxide covered by a film of silicon oxynitride
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
DE2836911C2 (de) * 1978-08-23 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Passivierungsschicht für Halbleiterbauelemente
FR2456787A1 (fr) * 1979-05-18 1980-12-12 Thomson Csf Dispositif hyperfrequence pour le depot de films minces sur des solides
US4282267A (en) * 1979-09-20 1981-08-04 Western Electric Co., Inc. Methods and apparatus for generating plasmas
US4262631A (en) * 1979-10-01 1981-04-21 Kubacki Ronald M Thin film deposition apparatus using an RF glow discharge
US4289797A (en) * 1979-10-11 1981-09-15 Western Electric Co., Incorporated Method of depositing uniform films of Six Ny or Six Oy in a plasma reactor
US4353777A (en) * 1981-04-20 1982-10-12 Lfe Corporation Selective plasma polysilicon etching
US4421592A (en) * 1981-05-22 1983-12-20 United Technologies Corporation Plasma enhanced deposition of semiconductors
US4609424A (en) * 1981-05-22 1986-09-02 United Technologies Corporation Plasma enhanced deposition of semiconductors
US4651673A (en) * 1982-09-02 1987-03-24 At&T Technologies, Inc. CVD apparatus
US4454835A (en) * 1982-09-13 1984-06-19 The United States Of America As Represented By The Secretary Of The Navy Internal photolysis reactor
US4517223A (en) * 1982-09-24 1985-05-14 Sovonics Solar Systems Method of making amorphous semiconductor alloys and devices using microwave energy
JPS60180998A (ja) * 1984-02-27 1985-09-14 Anelva Corp 分子線エピタキシヤル成長装置用の基板保持装置
GB8620273D0 (en) * 1986-08-20 1986-10-01 Gen Electric Co Plc Deposition of thin films
US4997677A (en) * 1987-08-31 1991-03-05 Massachusetts Institute Of Technology Vapor phase reactor for making multilayer structures
US4918031A (en) * 1988-12-28 1990-04-17 American Telephone And Telegraph Company,At&T Bell Laboratories Processes depending on plasma generation using a helical resonator
FR2666324B1 (fr) * 1990-09-03 1993-04-09 Saint Gobain Vitrage Int Couches minces de nitrure de silicium a proprietes ameliorees.
US5824158A (en) * 1993-06-30 1998-10-20 Kabushiki Kaisha Kobe Seiko Sho Chemical vapor deposition using inductively coupled plasma and system therefor
DE102006036536B3 (de) * 2006-07-31 2008-02-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum Plasmabehandeln einer Oberfläche

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB730669A (en) * 1951-12-28 1955-05-25 Erie Resistor Corp Gas plating apparatus
US2884894A (en) * 1956-11-02 1959-05-05 Metallgesellschaft Ag Apparatus for producing hard coatings on workpieces
US3460816A (en) * 1962-01-02 1969-08-12 Gen Electric Fluxless aluminum brazing furnace
NL6703526A (Direct) * 1966-05-02 1967-11-03
US3424661A (en) * 1966-09-01 1969-01-28 Bell Telephone Labor Inc Method of conducting chemical reactions in a glow discharge
US3655438A (en) * 1969-10-20 1972-04-11 Int Standard Electric Corp Method of forming silicon oxide coatings in an electric discharge
US3880112A (en) * 1971-10-20 1975-04-29 Commissariat Energie Atomique Device for the preparation of thin films
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
US3847652A (en) * 1972-12-08 1974-11-12 Nasa Method of preparing water purification membranes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54160568A (en) * 1978-06-09 1979-12-19 Anelva Corp Thin film forming equipment for discharge chemical reaction
JPS5595334A (en) * 1979-01-10 1980-07-19 Nec Corp Preparation of semiconductor device
JPS609180A (ja) * 1983-06-13 1985-01-18 アメリカン・テレフオン・アンド・テレグラフ・カムパニ− 半導体光検出器の製作方法

Also Published As

Publication number Publication date
DE2656821A1 (de) 1977-06-30
GB1533497A (en) 1978-11-29
JPS5433956B2 (Direct) 1979-10-24
US4066037A (en) 1978-01-03

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