JPS527565U - - Google Patents

Info

Publication number
JPS527565U
JPS527565U JP9359275U JP9359275U JPS527565U JP S527565 U JPS527565 U JP S527565U JP 9359275 U JP9359275 U JP 9359275U JP 9359275 U JP9359275 U JP 9359275U JP S527565 U JPS527565 U JP S527565U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9359275U
Other languages
Japanese (ja)
Other versions
JPS5527254Y2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975093592U priority Critical patent/JPS5527254Y2/ja
Publication of JPS527565U publication Critical patent/JPS527565U/ja
Application granted granted Critical
Publication of JPS5527254Y2 publication Critical patent/JPS5527254Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1975093592U 1975-07-03 1975-07-03 Expired JPS5527254Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975093592U JPS5527254Y2 (fr) 1975-07-03 1975-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975093592U JPS5527254Y2 (fr) 1975-07-03 1975-07-03

Publications (2)

Publication Number Publication Date
JPS527565U true JPS527565U (fr) 1977-01-19
JPS5527254Y2 JPS5527254Y2 (fr) 1980-06-30

Family

ID=28575452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975093592U Expired JPS5527254Y2 (fr) 1975-07-03 1975-07-03

Country Status (1)

Country Link
JP (1) JPS5527254Y2 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953379A (fr) * 1972-09-27 1974-05-23
JPS545264A (en) * 1977-06-15 1979-01-16 Shizuoka Seiki Co Ltd Stop control circuit for automatic dryer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953379A (fr) * 1972-09-27 1974-05-23
JPS545264A (en) * 1977-06-15 1979-01-16 Shizuoka Seiki Co Ltd Stop control circuit for automatic dryer

Also Published As

Publication number Publication date
JPS5527254Y2 (fr) 1980-06-30

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