JPS5268829A - Process for forming eutectic layer - Google Patents

Process for forming eutectic layer

Info

Publication number
JPS5268829A
JPS5268829A JP14502075A JP14502075A JPS5268829A JP S5268829 A JPS5268829 A JP S5268829A JP 14502075 A JP14502075 A JP 14502075A JP 14502075 A JP14502075 A JP 14502075A JP S5268829 A JPS5268829 A JP S5268829A
Authority
JP
Japan
Prior art keywords
eutectic layer
forming eutectic
forming
layer
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14502075A
Other languages
English (en)
Inventor
Kiyoo Nishida
Tatsuo Itagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14502075A priority Critical patent/JPS5268829A/ja
Publication of JPS5268829A publication Critical patent/JPS5268829A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Laminated Bodies (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Physical Vapour Deposition (AREA)
  • Die Bonding (AREA)
JP14502075A 1975-12-08 1975-12-08 Process for forming eutectic layer Pending JPS5268829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14502075A JPS5268829A (en) 1975-12-08 1975-12-08 Process for forming eutectic layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14502075A JPS5268829A (en) 1975-12-08 1975-12-08 Process for forming eutectic layer

Publications (1)

Publication Number Publication Date
JPS5268829A true JPS5268829A (en) 1977-06-08

Family

ID=15375563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14502075A Pending JPS5268829A (en) 1975-12-08 1975-12-08 Process for forming eutectic layer

Country Status (1)

Country Link
JP (1) JPS5268829A (ja)

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