JPS52675B2 - - Google Patents
Info
- Publication number
- JPS52675B2 JPS52675B2 JP13865473A JP13865473A JPS52675B2 JP S52675 B2 JPS52675 B2 JP S52675B2 JP 13865473 A JP13865473 A JP 13865473A JP 13865473 A JP13865473 A JP 13865473A JP S52675 B2 JPS52675 B2 JP S52675B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Die Bonding (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13865473A JPS52675B2 (es) | 1973-12-14 | 1973-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13865473A JPS52675B2 (es) | 1973-12-14 | 1973-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5092683A JPS5092683A (es) | 1975-07-24 |
| JPS52675B2 true JPS52675B2 (es) | 1977-01-10 |
Family
ID=15227019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13865473A Expired JPS52675B2 (es) | 1973-12-14 | 1973-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52675B2 (es) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143571U (es) * | 1974-09-25 | 1976-03-31 | ||
| US5037334A (en) * | 1990-11-30 | 1991-08-06 | Amp Corporated | Connector with equal lateral force contact spacer plate |
-
1973
- 1973-12-14 JP JP13865473A patent/JPS52675B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5092683A (es) | 1975-07-24 |