JPS5261152A - Brazing method - Google Patents
Brazing methodInfo
- Publication number
- JPS5261152A JPS5261152A JP13702175A JP13702175A JPS5261152A JP S5261152 A JPS5261152 A JP S5261152A JP 13702175 A JP13702175 A JP 13702175A JP 13702175 A JP13702175 A JP 13702175A JP S5261152 A JPS5261152 A JP S5261152A
- Authority
- JP
- Japan
- Prior art keywords
- brazing method
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13702175A JPS5261152A (en) | 1975-11-14 | 1975-11-14 | Brazing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13702175A JPS5261152A (en) | 1975-11-14 | 1975-11-14 | Brazing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5261152A true JPS5261152A (en) | 1977-05-20 |
Family
ID=15188970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13702175A Pending JPS5261152A (en) | 1975-11-14 | 1975-11-14 | Brazing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5261152A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61279394A (en) * | 1985-06-06 | 1986-12-10 | Mitsubishi Metal Corp | Brazed composite member |
WO2003064713A1 (en) * | 2002-01-30 | 2003-08-07 | Honeywell International Inc. | Thermal interface materials; and compositions comprising indium and zinc |
US8513800B2 (en) | 2006-09-19 | 2013-08-20 | Fujitsu Semiconductor Limited | Semiconductor device and method for manufacturing the same |
JP2013233577A (en) * | 2012-05-10 | 2013-11-21 | Sumitomo Metal Mining Co Ltd | Pb FREE In SOLDER ALLOY |
-
1975
- 1975-11-14 JP JP13702175A patent/JPS5261152A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61279394A (en) * | 1985-06-06 | 1986-12-10 | Mitsubishi Metal Corp | Brazed composite member |
JPH0378181B2 (en) * | 1985-06-06 | 1991-12-12 | Mitsubishi Materials Corp | |
WO2003064713A1 (en) * | 2002-01-30 | 2003-08-07 | Honeywell International Inc. | Thermal interface materials; and compositions comprising indium and zinc |
CN100362655C (en) * | 2002-01-30 | 2008-01-16 | 霍尼韦尔国际公司 | Thermal interface materials, and compositions comprising indium and zinc |
US8513800B2 (en) | 2006-09-19 | 2013-08-20 | Fujitsu Semiconductor Limited | Semiconductor device and method for manufacturing the same |
JP2013233577A (en) * | 2012-05-10 | 2013-11-21 | Sumitomo Metal Mining Co Ltd | Pb FREE In SOLDER ALLOY |
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