JPS5259587A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5259587A
JPS5259587A JP13117176A JP13117176A JPS5259587A JP S5259587 A JPS5259587 A JP S5259587A JP 13117176 A JP13117176 A JP 13117176A JP 13117176 A JP13117176 A JP 13117176A JP S5259587 A JPS5259587 A JP S5259587A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13117176A
Other languages
English (en)
Inventor
Eichi Teifuaato Kaaru
Kureiton Kabii Rotsukufuoodo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Japan Inc
Original Assignee
Yokogawa Hewlett Packard Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokogawa Hewlett Packard Ltd filed Critical Yokogawa Hewlett Packard Ltd
Publication of JPS5259587A publication Critical patent/JPS5259587A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP13117176A 1975-11-11 1976-10-29 Semiconductor device Pending JPS5259587A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63082575A 1975-11-11 1975-11-11

Publications (1)

Publication Number Publication Date
JPS5259587A true JPS5259587A (en) 1977-05-17

Family

ID=24528698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13117176A Pending JPS5259587A (en) 1975-11-11 1976-10-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5259587A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5466083A (en) * 1977-11-05 1979-05-28 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS59180453U (ja) * 1983-05-19 1984-12-01 新日本無線株式会社 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921076A (ja) * 1972-06-16 1974-02-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921076A (ja) * 1972-06-16 1974-02-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5466083A (en) * 1977-11-05 1979-05-28 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS59180453U (ja) * 1983-05-19 1984-12-01 新日本無線株式会社 半導体装置

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