JPS5252462U - - Google Patents

Info

Publication number
JPS5252462U
JPS5252462U JP1975138714U JP13871475U JPS5252462U JP S5252462 U JPS5252462 U JP S5252462U JP 1975138714 U JP1975138714 U JP 1975138714U JP 13871475 U JP13871475 U JP 13871475U JP S5252462 U JPS5252462 U JP S5252462U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975138714U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975138714U priority Critical patent/JPS5252462U/ja
Publication of JPS5252462U publication Critical patent/JPS5252462U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP1975138714U 1975-10-11 1975-10-11 Pending JPS5252462U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975138714U JPS5252462U (en) 1975-10-11 1975-10-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975138714U JPS5252462U (en) 1975-10-11 1975-10-11

Publications (1)

Publication Number Publication Date
JPS5252462U true JPS5252462U (en) 1977-04-14

Family

ID=28618602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975138714U Pending JPS5252462U (en) 1975-10-11 1975-10-11

Country Status (1)

Country Link
JP (1) JPS5252462U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093183A1 (en) * 1995-03-17 2004-10-28 Atsushi Hino Film carrier and semiconductor device using the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823961U (en) * 1971-07-26 1973-03-19
JPS5028656A (en) * 1973-07-20 1975-03-24
JPS5026294U (en) * 1973-07-02 1975-03-26

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823961U (en) * 1971-07-26 1973-03-19
JPS5026294U (en) * 1973-07-02 1975-03-26
JPS5028656A (en) * 1973-07-20 1975-03-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004093183A1 (en) * 1995-03-17 2004-10-28 Atsushi Hino Film carrier and semiconductor device using the same

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