JPS5248361U - - Google Patents
Info
- Publication number
- JPS5248361U JPS5248361U JP1975134547U JP13454775U JPS5248361U JP S5248361 U JPS5248361 U JP S5248361U JP 1975134547 U JP1975134547 U JP 1975134547U JP 13454775 U JP13454775 U JP 13454775U JP S5248361 U JPS5248361 U JP S5248361U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975134547U JPS5734767Y2 (https=) | 1975-09-30 | 1975-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975134547U JPS5734767Y2 (https=) | 1975-09-30 | 1975-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5248361U true JPS5248361U (https=) | 1977-04-06 |
| JPS5734767Y2 JPS5734767Y2 (https=) | 1982-07-31 |
Family
ID=28614595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975134547U Expired JPS5734767Y2 (https=) | 1975-09-30 | 1975-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5734767Y2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532001U (https=) * | 1978-06-16 | 1980-03-01 | ||
| JPS605194U (ja) * | 1983-06-23 | 1985-01-14 | 富士通株式会社 | プリント板実装機構 |
| JP2008042100A (ja) * | 2006-08-09 | 2008-02-21 | Sanken Electric Co Ltd | 半導体装置及びリードフレーム組立体の製法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50128465A (https=) * | 1974-03-27 | 1975-10-09 |
-
1975
- 1975-09-30 JP JP1975134547U patent/JPS5734767Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50128465A (https=) * | 1974-03-27 | 1975-10-09 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532001U (https=) * | 1978-06-16 | 1980-03-01 | ||
| JPS605194U (ja) * | 1983-06-23 | 1985-01-14 | 富士通株式会社 | プリント板実装機構 |
| JP2008042100A (ja) * | 2006-08-09 | 2008-02-21 | Sanken Electric Co Ltd | 半導体装置及びリードフレーム組立体の製法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5734767Y2 (https=) | 1982-07-31 |