JPS5248361U - - Google Patents

Info

Publication number
JPS5248361U
JPS5248361U JP13454775U JP13454775U JPS5248361U JP S5248361 U JPS5248361 U JP S5248361U JP 13454775 U JP13454775 U JP 13454775U JP 13454775 U JP13454775 U JP 13454775U JP S5248361 U JPS5248361 U JP S5248361U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13454775U
Other languages
Japanese (ja)
Other versions
JPS5734767Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975134547U priority Critical patent/JPS5734767Y2/ja
Publication of JPS5248361U publication Critical patent/JPS5248361U/ja
Application granted granted Critical
Publication of JPS5734767Y2 publication Critical patent/JPS5734767Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP1975134547U 1975-09-30 1975-09-30 Expired JPS5734767Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975134547U JPS5734767Y2 (en) 1975-09-30 1975-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975134547U JPS5734767Y2 (en) 1975-09-30 1975-09-30

Publications (2)

Publication Number Publication Date
JPS5248361U true JPS5248361U (en) 1977-04-06
JPS5734767Y2 JPS5734767Y2 (en) 1982-07-31

Family

ID=28614595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975134547U Expired JPS5734767Y2 (en) 1975-09-30 1975-09-30

Country Status (1)

Country Link
JP (1) JPS5734767Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532001U (en) * 1978-06-16 1980-03-01
JPS605194U (en) * 1983-06-23 1985-01-14 富士通株式会社 Printed board mounting mechanism
JP2008042100A (en) * 2006-08-09 2008-02-21 Sanken Electric Co Ltd Semiconductor device, and method of manufacturing lead frame assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128465A (en) * 1974-03-27 1975-10-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50128465A (en) * 1974-03-27 1975-10-09

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5532001U (en) * 1978-06-16 1980-03-01
JPS587674Y2 (en) * 1978-06-16 1983-02-10 松下電器産業株式会社 waterproof case
JPS605194U (en) * 1983-06-23 1985-01-14 富士通株式会社 Printed board mounting mechanism
JPH0349437Y2 (en) * 1983-06-23 1991-10-22
JP2008042100A (en) * 2006-08-09 2008-02-21 Sanken Electric Co Ltd Semiconductor device, and method of manufacturing lead frame assembly

Also Published As

Publication number Publication date
JPS5734767Y2 (en) 1982-07-31

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