JPS5243985Y2 - - Google Patents

Info

Publication number
JPS5243985Y2
JPS5243985Y2 JP12468072U JP12468072U JPS5243985Y2 JP S5243985 Y2 JPS5243985 Y2 JP S5243985Y2 JP 12468072 U JP12468072 U JP 12468072U JP 12468072 U JP12468072 U JP 12468072U JP S5243985 Y2 JPS5243985 Y2 JP S5243985Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12468072U
Other languages
Japanese (ja)
Other versions
JPS4980180U (ro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12468072U priority Critical patent/JPS5243985Y2/ja
Publication of JPS4980180U publication Critical patent/JPS4980180U/ja
Application granted granted Critical
Publication of JPS5243985Y2 publication Critical patent/JPS5243985Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP12468072U 1972-10-28 1972-10-28 Expired JPS5243985Y2 (ro)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12468072U JPS5243985Y2 (ro) 1972-10-28 1972-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12468072U JPS5243985Y2 (ro) 1972-10-28 1972-10-28

Publications (2)

Publication Number Publication Date
JPS4980180U JPS4980180U (ro) 1974-07-11
JPS5243985Y2 true JPS5243985Y2 (ro) 1977-10-05

Family

ID=28373729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12468072U Expired JPS5243985Y2 (ro) 1972-10-28 1972-10-28

Country Status (1)

Country Link
JP (1) JPS5243985Y2 (ro)

Also Published As

Publication number Publication date
JPS4980180U (ro) 1974-07-11

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