JPS5243985Y2 - - Google Patents

Info

Publication number
JPS5243985Y2
JPS5243985Y2 JP12468072U JP12468072U JPS5243985Y2 JP S5243985 Y2 JPS5243985 Y2 JP S5243985Y2 JP 12468072 U JP12468072 U JP 12468072U JP 12468072 U JP12468072 U JP 12468072U JP S5243985 Y2 JPS5243985 Y2 JP S5243985Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12468072U
Other languages
Japanese (ja)
Other versions
JPS4980180U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12468072U priority Critical patent/JPS5243985Y2/ja
Publication of JPS4980180U publication Critical patent/JPS4980180U/ja
Application granted granted Critical
Publication of JPS5243985Y2 publication Critical patent/JPS5243985Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP12468072U 1972-10-28 1972-10-28 Expired JPS5243985Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12468072U JPS5243985Y2 (enrdf_load_html_response) 1972-10-28 1972-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12468072U JPS5243985Y2 (enrdf_load_html_response) 1972-10-28 1972-10-28

Publications (2)

Publication Number Publication Date
JPS4980180U JPS4980180U (enrdf_load_html_response) 1974-07-11
JPS5243985Y2 true JPS5243985Y2 (enrdf_load_html_response) 1977-10-05

Family

ID=28373729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12468072U Expired JPS5243985Y2 (enrdf_load_html_response) 1972-10-28 1972-10-28

Country Status (1)

Country Link
JP (1) JPS5243985Y2 (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS4980180U (enrdf_load_html_response) 1974-07-11

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