JPS5243284Y2 - - Google Patents
Info
- Publication number
- JPS5243284Y2 JPS5243284Y2 JP8606672U JP8606672U JPS5243284Y2 JP S5243284 Y2 JPS5243284 Y2 JP S5243284Y2 JP 8606672 U JP8606672 U JP 8606672U JP 8606672 U JP8606672 U JP 8606672U JP S5243284 Y2 JPS5243284 Y2 JP S5243284Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8606672U JPS5243284Y2 (cs) | 1972-07-20 | 1972-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8606672U JPS5243284Y2 (cs) | 1972-07-20 | 1972-07-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4944234U JPS4944234U (cs) | 1974-04-18 |
| JPS5243284Y2 true JPS5243284Y2 (cs) | 1977-10-01 |
Family
ID=27996522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8606672U Expired JPS5243284Y2 (cs) | 1972-07-20 | 1972-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5243284Y2 (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12136604B2 (en) | 2020-12-21 | 2024-11-05 | Shinkawa Ltd. | Bonding apparatus and bonding method |
-
1972
- 1972-07-20 JP JP8606672U patent/JPS5243284Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12136604B2 (en) | 2020-12-21 | 2024-11-05 | Shinkawa Ltd. | Bonding apparatus and bonding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4944234U (cs) | 1974-04-18 |