JPS5241629B2 - - Google Patents
Info
- Publication number
- JPS5241629B2 JPS5241629B2 JP51069776A JP6977676A JPS5241629B2 JP S5241629 B2 JPS5241629 B2 JP S5241629B2 JP 51069776 A JP51069776 A JP 51069776A JP 6977676 A JP6977676 A JP 6977676A JP S5241629 B2 JPS5241629 B2 JP S5241629B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51069776A JPS5267265A (en) | 1976-06-16 | 1976-06-16 | Glass sealing type semiconductor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP51069776A JPS5267265A (en) | 1976-06-16 | 1976-06-16 | Glass sealing type semiconductor unit |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50041293A Division JPS51122376A (en) | 1975-04-07 | 1975-04-07 | Method of manufacture of glass sealed semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5267265A JPS5267265A (en) | 1977-06-03 |
| JPS5241629B2 true JPS5241629B2 (en) | 1977-10-19 |
Family
ID=13412510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51069776A Granted JPS5267265A (en) | 1976-06-16 | 1976-06-16 | Glass sealing type semiconductor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5267265A (en) |
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1976
- 1976-06-16 JP JP51069776A patent/JPS5267265A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5267265A (en) | 1977-06-03 |