JPS5237451U - - Google Patents
Info
- Publication number
- JPS5237451U JPS5237451U JP12374375U JP12374375U JPS5237451U JP S5237451 U JPS5237451 U JP S5237451U JP 12374375 U JP12374375 U JP 12374375U JP 12374375 U JP12374375 U JP 12374375U JP S5237451 U JPS5237451 U JP S5237451U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12374375U JPS5237451U (enrdf_load_stackoverflow) | 1975-09-08 | 1975-09-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12374375U JPS5237451U (enrdf_load_stackoverflow) | 1975-09-08 | 1975-09-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5237451U true JPS5237451U (enrdf_load_stackoverflow) | 1977-03-16 |
Family
ID=28604297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12374375U Pending JPS5237451U (enrdf_load_stackoverflow) | 1975-09-08 | 1975-09-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5237451U (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01168710U (enrdf_load_stackoverflow) * | 1988-05-18 | 1989-11-28 |
-
1975
- 1975-09-08 JP JP12374375U patent/JPS5237451U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01168710U (enrdf_load_stackoverflow) * | 1988-05-18 | 1989-11-28 |