JPS5236758A - Method of producing printed circuit - Google Patents

Method of producing printed circuit

Info

Publication number
JPS5236758A
JPS5236758A JP51100456A JP10045676A JPS5236758A JP S5236758 A JPS5236758 A JP S5236758A JP 51100456 A JP51100456 A JP 51100456A JP 10045676 A JP10045676 A JP 10045676A JP S5236758 A JPS5236758 A JP S5236758A
Authority
JP
Japan
Prior art keywords
printed circuit
producing printed
producing
circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP51100456A
Other languages
English (en)
Japanese (ja)
Inventor
Hatsuke Hansuyurugen
Haadaasupetsuku Hansu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS5236758A publication Critical patent/JPS5236758A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0505—Double exposure of the same photosensitive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP51100456A 1975-09-16 1976-08-23 Method of producing printed circuit Pending JPS5236758A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752541280 DE2541280A1 (de) 1975-09-16 1975-09-16 Verfahren zur herstellung einer gedruckten verdrahtung mit lotabweisenden teilbereichen

Publications (1)

Publication Number Publication Date
JPS5236758A true JPS5236758A (en) 1977-03-22

Family

ID=5956607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51100456A Pending JPS5236758A (en) 1975-09-16 1976-08-23 Method of producing printed circuit

Country Status (13)

Country Link
US (1) US4268349A (enExample)
JP (1) JPS5236758A (enExample)
AT (1) AT364017B (enExample)
BE (1) BE846282A (enExample)
BR (1) BR7605828A (enExample)
CA (1) CA1051559A (enExample)
CH (1) CH607545A5 (enExample)
DE (1) DE2541280A1 (enExample)
FR (1) FR2325269A1 (enExample)
GB (1) GB1517235A (enExample)
IT (1) IT1068137B (enExample)
NL (1) NL7609577A (enExample)
SE (1) SE7609871L (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2861486D1 (en) * 1977-11-21 1982-02-18 Ciba Geigy Ag Process for the application of soldering masks to printed circuits with through holes for contacting
US4512829A (en) * 1983-04-07 1985-04-23 Satosen Co., Ltd. Process for producing printed circuit boards
US4537799A (en) * 1984-04-16 1985-08-27 At&T Technologies, Inc. Selective metallization process
GB9401869D0 (en) * 1994-02-01 1994-03-30 Heinze Dyconex Patente Improvements in and relating to printed circuit boards
US8826852B2 (en) 2010-04-12 2014-09-09 Engineered Products And Services, Inc. Optimized double washer pull plug for minimizing coating error
USD655998S1 (en) * 2010-04-12 2012-03-20 Engineered Products And Services, Inc. Double washer pull plug
CN110856364A (zh) * 2019-11-21 2020-02-28 珠海市凯诺微电子有限公司 一种用于制造软硬结合板的沉镀金方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443988A (en) * 1965-05-06 1969-05-13 Photocircuits Corp Printed circuits,work holders and method of preventing electroless metal deposition
DE1812692A1 (de) * 1968-12-04 1970-11-05 Siemens Ag Verfahren zur Herstellung von mit Leiterbahnen versehenen Schaltungsplatten
US3599326A (en) * 1969-01-27 1971-08-17 Philco Ford Corp Method of forming electrical connections with solder resistant surfaces
US3610811A (en) * 1969-06-02 1971-10-05 Honeywell Inf Systems Printed circuit board with solder resist gas escape ports
GB1310880A (en) * 1969-06-13 1973-03-21 Microponent Dev Ltd Multi-layer printed circuit board assemblies
US3686625A (en) * 1969-12-10 1972-08-22 Molex Products Co Solder resist
DE2140274A1 (de) * 1971-08-11 1973-02-15 Bbc Brown Boveri & Cie Mittel und verfahren zur verhinderung des festhaftens von schweisspritzern
US3945826A (en) * 1972-04-14 1976-03-23 Howard Friedman Method of chemical machining utilizing same coating of positive photoresist to etch and electroplate
US3990982A (en) * 1974-12-18 1976-11-09 Rbp Chemical Corporation Composition for stripping lead-tin solder

Also Published As

Publication number Publication date
GB1517235A (en) 1978-07-12
BR7605828A (pt) 1977-08-16
IT1068137B (it) 1985-03-21
BE846282A (fr) 1977-01-17
AT364017B (de) 1981-09-25
DE2541280A1 (de) 1977-03-17
CH607545A5 (enExample) 1978-12-29
CA1051559A (en) 1979-03-27
FR2325269A1 (fr) 1977-04-15
FR2325269B1 (enExample) 1980-09-05
NL7609577A (nl) 1977-03-18
SE7609871L (sv) 1977-03-17
US4268349A (en) 1981-05-19
ATA599576A (de) 1981-02-15

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