JPS5235992B2 - - Google Patents
Info
- Publication number
- JPS5235992B2 JPS5235992B2 JP49086987A JP8698774A JPS5235992B2 JP S5235992 B2 JPS5235992 B2 JP S5235992B2 JP 49086987 A JP49086987 A JP 49086987A JP 8698774 A JP8698774 A JP 8698774A JP S5235992 B2 JPS5235992 B2 JP S5235992B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49086987A JPS5235992B2 (en:Method) | 1974-07-31 | 1974-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49086987A JPS5235992B2 (en:Method) | 1974-07-31 | 1974-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5115971A JPS5115971A (en:Method) | 1976-02-07 |
| JPS5235992B2 true JPS5235992B2 (en:Method) | 1977-09-12 |
Family
ID=13902204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49086987A Expired JPS5235992B2 (en:Method) | 1974-07-31 | 1974-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5235992B2 (en:Method) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5356766U (en:Method) * | 1976-10-15 | 1978-05-15 | ||
| JPH05187050A (ja) * | 1992-01-14 | 1993-07-27 | Sekisui Chem Co Ltd | 真空バルブの結露検知装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4914395A (en:Method) * | 1972-06-02 | 1974-02-07 |
-
1974
- 1974-07-31 JP JP49086987A patent/JPS5235992B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5115971A (en:Method) | 1976-02-07 |