JPS5232266A - Blazing material for semiconductor device - Google Patents

Blazing material for semiconductor device

Info

Publication number
JPS5232266A
JPS5232266A JP10825475A JP10825475A JPS5232266A JP S5232266 A JPS5232266 A JP S5232266A JP 10825475 A JP10825475 A JP 10825475A JP 10825475 A JP10825475 A JP 10825475A JP S5232266 A JPS5232266 A JP S5232266A
Authority
JP
Japan
Prior art keywords
semiconductor device
blazing
blazing material
melting point
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10825475A
Other languages
Japanese (ja)
Other versions
JPS582755B2 (en
Inventor
Kenichi Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10825475A priority Critical patent/JPS582755B2/en
Publication of JPS5232266A publication Critical patent/JPS5232266A/en
Publication of JPS582755B2 publication Critical patent/JPS582755B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To obtain blazing material for semiconductor devices with good workability by annexing aluminum, which has low melting point and which is low in melting point, in metal-tin alloy balzing material.
JP10825475A 1975-09-05 1975-09-05 hand-made thailand Expired JPS582755B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10825475A JPS582755B2 (en) 1975-09-05 1975-09-05 hand-made thailand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10825475A JPS582755B2 (en) 1975-09-05 1975-09-05 hand-made thailand

Publications (2)

Publication Number Publication Date
JPS5232266A true JPS5232266A (en) 1977-03-11
JPS582755B2 JPS582755B2 (en) 1983-01-18

Family

ID=14479989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10825475A Expired JPS582755B2 (en) 1975-09-05 1975-09-05 hand-made thailand

Country Status (1)

Country Link
JP (1) JPS582755B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770099A (en) * 1980-10-20 1982-04-30 Seiko Epson Corp Gold brazing filler metal
JPS62282258A (en) * 1986-05-30 1987-12-08 Koyo Seiko Co Ltd Apparatus for foreseeing life of bearing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014200794A (en) * 2013-04-01 2014-10-27 住友金属鉱山株式会社 Au-Sn BASED SOLDER ALLOY

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5770099A (en) * 1980-10-20 1982-04-30 Seiko Epson Corp Gold brazing filler metal
JPS6347558B2 (en) * 1980-10-20 1988-09-22 Seiko Epson Corp
JPS62282258A (en) * 1986-05-30 1987-12-08 Koyo Seiko Co Ltd Apparatus for foreseeing life of bearing

Also Published As

Publication number Publication date
JPS582755B2 (en) 1983-01-18

Similar Documents

Publication Publication Date Title
JPS51131185A (en) Electronic scintillation device
JPS5232266A (en) Blazing material for semiconductor device
JPS5233480A (en) Semiconductor device
JPS5228868A (en) Semiconductor device
KROPSCHOT et al. Low-temperature tensile properties of copper and four bronzes
JPS51112200A (en) Lighting equipment in liquid crystal indicator
JPS532061A (en) Flip-flop circuit
JPS51129898A (en) The synthesis of silicon oxyntride whiskers
JPS5225564A (en) Semiconductor thin-film monocrystal
JPS5322383A (en) Iil simiconductor device
JPS5241052A (en) Umbrella
JPS51129191A (en) Semiconductor device
JPS51151926A (en) Sunviser
JPS5343568A (en) Clock
JPS5218586A (en) Manual control system
JPS51133671A (en) Hydraulic device with deairing device
JPS5226136A (en) Electronic desk calculator
JPS51132754A (en) Wide working range gate circuit
JPS51132782A (en) Tri-polar type bidirectional thyristor
JPS5274755A (en) Combining device of nut and washer
JPS5231684A (en) Semiconductor device
JPS5261903A (en) Telephone no. deigita lindicator
JPS5224066A (en) And-gate element
JPS5414105A (en) Extension telephone set
JPS52112800A (en) Electrical insulation composition