JPS5230377B2 - - Google Patents
Info
- Publication number
- JPS5230377B2 JPS5230377B2 JP12801074A JP12801074A JPS5230377B2 JP S5230377 B2 JPS5230377 B2 JP S5230377B2 JP 12801074 A JP12801074 A JP 12801074A JP 12801074 A JP12801074 A JP 12801074A JP S5230377 B2 JPS5230377 B2 JP S5230377B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12801074A JPS5154056A (ja) | 1974-11-08 | 1974-11-08 | Handagokin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12801074A JPS5154056A (ja) | 1974-11-08 | 1974-11-08 | Handagokin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5154056A JPS5154056A (ja) | 1976-05-12 |
JPS5230377B2 true JPS5230377B2 (ja) | 1977-08-08 |
Family
ID=14974230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12801074A Granted JPS5154056A (ja) | 1974-11-08 | 1974-11-08 | Handagokin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5154056A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59183993A (ja) * | 1983-04-04 | 1984-10-19 | Hitachi Ltd | ろう接構造 |
US5011658A (en) * | 1989-05-31 | 1991-04-30 | International Business Machines Corporation | Copper doped low melt solder for component assembly and rework |
CN105290640A (zh) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | 一种无铅焊锡条 |
MX2021008527A (es) * | 2019-01-30 | 2021-11-12 | Metallo Belgium | Producción mejorada de estaño. |
-
1974
- 1974-11-08 JP JP12801074A patent/JPS5154056A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5154056A (ja) | 1976-05-12 |