JPS5229831B2 - - Google Patents
Info
- Publication number
- JPS5229831B2 JPS5229831B2 JP4733272A JP4733272A JPS5229831B2 JP S5229831 B2 JPS5229831 B2 JP S5229831B2 JP 4733272 A JP4733272 A JP 4733272A JP 4733272 A JP4733272 A JP 4733272A JP S5229831 B2 JPS5229831 B2 JP S5229831B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733272A JPS5229831B2 (en:Method) | 1972-05-13 | 1972-05-13 | |
| AU55530/73A AU471519B2 (en) | 1972-05-13 | 1973-05-10 | Laminate tape and laminate sheath cable |
| FR7317228A FR2184765B1 (en:Method) | 1972-05-13 | 1973-05-11 | |
| GB2269773A GB1411023A (en) | 1972-05-13 | 1973-05-11 | Laminated tape for sheathing cable |
| DE2324315A DE2324315B2 (de) | 1972-05-13 | 1973-05-14 | Beschichtetes Metallband und hiermit hergestelltes elektrisches Mantelkabel |
| US05/359,944 US3935375A (en) | 1972-05-13 | 1973-05-14 | Laminate tape and laminate sheathed cable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4733272A JPS5229831B2 (en:Method) | 1972-05-13 | 1972-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS497777A JPS497777A (en:Method) | 1974-01-23 |
| JPS5229831B2 true JPS5229831B2 (en:Method) | 1977-08-04 |
Family
ID=12772259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4733272A Expired JPS5229831B2 (en:Method) | 1972-05-13 | 1972-05-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5229831B2 (en:Method) |
| AU (1) | AU471519B2 (en:Method) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6113761A (en) | 1999-06-02 | 2000-09-05 | Johnson Matthey Electronics, Inc. | Copper sputtering target assembly and method of making same |
| US6858102B1 (en) | 2000-11-15 | 2005-02-22 | Honeywell International Inc. | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets |
| AU1609501A (en) | 1999-11-24 | 2001-06-04 | Honeywell International, Inc. | Physical vapor deposition targets, conductive integrated circuit metal alloy interconnections, electroplating anodes, and metal alloys for use as a conductive interconnection in an integrated circuit |
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1972
- 1972-05-13 JP JP4733272A patent/JPS5229831B2/ja not_active Expired
-
1973
- 1973-05-10 AU AU55530/73A patent/AU471519B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AU5553073A (en) | 1974-11-14 |
| AU471519B2 (en) | 1976-04-29 |
| JPS497777A (en:Method) | 1974-01-23 |