JPS5228067U - - Google Patents
Info
- Publication number
- JPS5228067U JPS5228067U JP11546975U JP11546975U JPS5228067U JP S5228067 U JPS5228067 U JP S5228067U JP 11546975 U JP11546975 U JP 11546975U JP 11546975 U JP11546975 U JP 11546975U JP S5228067 U JPS5228067 U JP S5228067U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11546975U JPS5228067U (en) | 1975-08-20 | 1975-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11546975U JPS5228067U (en) | 1975-08-20 | 1975-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5228067U true JPS5228067U (en) | 1977-02-26 |
Family
ID=28596445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11546975U Pending JPS5228067U (en) | 1975-08-20 | 1975-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5228067U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| JPS5879799A (en) * | 1981-11-06 | 1983-05-13 | 松下電器産業株式会社 | Method of producing hybrid integrated circuit |
| WO2015094259A1 (en) | 2013-12-19 | 2015-06-25 | Intel Corporation | Flexibly-wrapped integrated circuit die |
-
1975
- 1975-08-20 JP JP11546975U patent/JPS5228067U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57193094A (en) * | 1981-05-18 | 1982-11-27 | Matsushita Electric Ind Co Ltd | Electronic circuit part and method of mounting same |
| JPS5879799A (en) * | 1981-11-06 | 1983-05-13 | 松下電器産業株式会社 | Method of producing hybrid integrated circuit |
| WO2015094259A1 (en) | 2013-12-19 | 2015-06-25 | Intel Corporation | Flexibly-wrapped integrated circuit die |
| CN106030781A (en) * | 2013-12-19 | 2016-10-12 | 英特尔公司 | Flexibly-wrapped integrated circuit die |
| JP2016537814A (en) * | 2013-12-19 | 2016-12-01 | インテル・コーポレーション | Integrated circuit die device, integrated circuit die device encased with flexibility, and method of mounting an integrated circuit die encased with flexibility on a substrate |
| US20170084578A1 (en) * | 2013-12-19 | 2017-03-23 | Intel Corporation | Flexibly-wrapped integrated circuit die |