JPS5227919U - - Google Patents
Info
- Publication number
- JPS5227919U JPS5227919U JP11414975U JP11414975U JPS5227919U JP S5227919 U JPS5227919 U JP S5227919U JP 11414975 U JP11414975 U JP 11414975U JP 11414975 U JP11414975 U JP 11414975U JP S5227919 U JPS5227919 U JP S5227919U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11414975U JPS5227919U (en) | 1975-08-18 | 1975-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11414975U JPS5227919U (en) | 1975-08-18 | 1975-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5227919U true JPS5227919U (en) | 1977-02-26 |
Family
ID=28595186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11414975U Pending JPS5227919U (en) | 1975-08-18 | 1975-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5227919U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015116577A (en) * | 2013-12-17 | 2015-06-25 | 三菱電機株式会社 | Bonding method of clad metal with metal component, and method for manufacturing thermal tripping device with use of the bonding method, and circuit breaker |
-
1975
- 1975-08-18 JP JP11414975U patent/JPS5227919U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015116577A (en) * | 2013-12-17 | 2015-06-25 | 三菱電機株式会社 | Bonding method of clad metal with metal component, and method for manufacturing thermal tripping device with use of the bonding method, and circuit breaker |