JPS5225297B2 - - Google Patents
Info
- Publication number
- JPS5225297B2 JPS5225297B2 JP48144120A JP14412073A JPS5225297B2 JP S5225297 B2 JPS5225297 B2 JP S5225297B2 JP 48144120 A JP48144120 A JP 48144120A JP 14412073 A JP14412073 A JP 14412073A JP S5225297 B2 JPS5225297 B2 JP S5225297B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48144120A JPS5225297B2 (https=) | 1973-12-26 | 1973-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48144120A JPS5225297B2 (https=) | 1973-12-26 | 1973-12-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5098274A JPS5098274A (https=) | 1975-08-05 |
| JPS5225297B2 true JPS5225297B2 (https=) | 1977-07-06 |
Family
ID=15354643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48144120A Expired JPS5225297B2 (https=) | 1973-12-26 | 1973-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5225297B2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5557911U (https=) * | 1978-10-16 | 1980-04-19 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6163843U (https=) * | 1984-09-28 | 1986-04-30 | ||
| US5841190A (en) * | 1995-05-19 | 1998-11-24 | Ibiden Co., Ltd. | High density multi-layered printed wiring board, multi-chip carrier and semiconductor package |
-
1973
- 1973-12-26 JP JP48144120A patent/JPS5225297B2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5557911U (https=) * | 1978-10-16 | 1980-04-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5098274A (https=) | 1975-08-05 |