JPS522154U - - Google Patents

Info

Publication number
JPS522154U
JPS522154U JP1975086674U JP8667475U JPS522154U JP S522154 U JPS522154 U JP S522154U JP 1975086674 U JP1975086674 U JP 1975086674U JP 8667475 U JP8667475 U JP 8667475U JP S522154 U JPS522154 U JP S522154U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975086674U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975086674U priority Critical patent/JPS522154U/ja
Publication of JPS522154U publication Critical patent/JPS522154U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01208—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1975086674U 1975-06-24 1975-06-24 Pending JPS522154U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975086674U JPS522154U (ja) 1975-06-24 1975-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975086674U JPS522154U (ja) 1975-06-24 1975-06-24

Publications (1)

Publication Number Publication Date
JPS522154U true JPS522154U (ja) 1977-01-08

Family

ID=28569067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975086674U Pending JPS522154U (ja) 1975-06-24 1975-06-24

Country Status (1)

Country Link
JP (1) JPS522154U (ja)

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