JPS5218659U - - Google Patents

Info

Publication number
JPS5218659U
JPS5218659U JP1975104025U JP10402575U JPS5218659U JP S5218659 U JPS5218659 U JP S5218659U JP 1975104025 U JP1975104025 U JP 1975104025U JP 10402575 U JP10402575 U JP 10402575U JP S5218659 U JPS5218659 U JP S5218659U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1975104025U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975104025U priority Critical patent/JPS5218659U/ja
Publication of JPS5218659U publication Critical patent/JPS5218659U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
JP1975104025U 1975-07-25 1975-07-25 Pending JPS5218659U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975104025U JPS5218659U (en) 1975-07-25 1975-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975104025U JPS5218659U (en) 1975-07-25 1975-07-25

Publications (1)

Publication Number Publication Date
JPS5218659U true JPS5218659U (en) 1977-02-09

Family

ID=28585396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975104025U Pending JPS5218659U (en) 1975-07-25 1975-07-25

Country Status (1)

Country Link
JP (1) JPS5218659U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59115853U (en) * 1983-01-25 1984-08-04 川崎重工業株式会社 air cleaner
JPS59121466U (en) * 1983-02-03 1984-08-16 富士重工業株式会社 air cleaner
JPS6073869U (en) * 1983-10-27 1985-05-24 本田技研工業株式会社 Motorcycle air cleaner structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59115853U (en) * 1983-01-25 1984-08-04 川崎重工業株式会社 air cleaner
JPS59121466U (en) * 1983-02-03 1984-08-16 富士重工業株式会社 air cleaner
JPS6313417Y2 (en) * 1983-02-03 1988-04-15
JPS6073869U (en) * 1983-10-27 1985-05-24 本田技研工業株式会社 Motorcycle air cleaner structure

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