JPS5216866U - - Google Patents
Info
- Publication number
- JPS5216866U JPS5216866U JP10328275U JP10328275U JPS5216866U JP S5216866 U JPS5216866 U JP S5216866U JP 10328275 U JP10328275 U JP 10328275U JP 10328275 U JP10328275 U JP 10328275U JP S5216866 U JPS5216866 U JP S5216866U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10328275U JPS5540762Y2 (ko) | 1975-07-24 | 1975-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10328275U JPS5540762Y2 (ko) | 1975-07-24 | 1975-07-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5216866U true JPS5216866U (ko) | 1977-02-05 |
| JPS5540762Y2 JPS5540762Y2 (ko) | 1980-09-24 |
Family
ID=28584681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10328275U Expired JPS5540762Y2 (ko) | 1975-07-24 | 1975-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5540762Y2 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112980343A (zh) * | 2019-12-13 | 2021-06-18 | 日东电工株式会社 | 半导体加工用粘合片及其利用 |
-
1975
- 1975-07-24 JP JP10328275U patent/JPS5540762Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112980343A (zh) * | 2019-12-13 | 2021-06-18 | 日东电工株式会社 | 半导体加工用粘合片及其利用 |
| JP2021095450A (ja) * | 2019-12-13 | 2021-06-24 | 日東電工株式会社 | 半導体加工用粘着シートおよびその利用 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5540762Y2 (ko) | 1980-09-24 |