JPS5216866U - - Google Patents

Info

Publication number
JPS5216866U
JPS5216866U JP10328275U JP10328275U JPS5216866U JP S5216866 U JPS5216866 U JP S5216866U JP 10328275 U JP10328275 U JP 10328275U JP 10328275 U JP10328275 U JP 10328275U JP S5216866 U JPS5216866 U JP S5216866U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10328275U
Other languages
Japanese (ja)
Other versions
JPS5540762Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10328275U priority Critical patent/JPS5540762Y2/ja
Publication of JPS5216866U publication Critical patent/JPS5216866U/ja
Application granted granted Critical
Publication of JPS5540762Y2 publication Critical patent/JPS5540762Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP10328275U 1975-07-24 1975-07-24 Expired JPS5540762Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10328275U JPS5540762Y2 (enrdf_load_html_response) 1975-07-24 1975-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10328275U JPS5540762Y2 (enrdf_load_html_response) 1975-07-24 1975-07-24

Publications (2)

Publication Number Publication Date
JPS5216866U true JPS5216866U (enrdf_load_html_response) 1977-02-05
JPS5540762Y2 JPS5540762Y2 (enrdf_load_html_response) 1980-09-24

Family

ID=28584681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10328275U Expired JPS5540762Y2 (enrdf_load_html_response) 1975-07-24 1975-07-24

Country Status (1)

Country Link
JP (1) JPS5540762Y2 (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980343A (zh) * 2019-12-13 2021-06-18 日东电工株式会社 半导体加工用粘合片及其利用

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112980343A (zh) * 2019-12-13 2021-06-18 日东电工株式会社 半导体加工用粘合片及其利用
JP2021095450A (ja) * 2019-12-13 2021-06-24 日東電工株式会社 半導体加工用粘着シートおよびその利用

Also Published As

Publication number Publication date
JPS5540762Y2 (enrdf_load_html_response) 1980-09-24

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