JPS52168559U - - Google Patents

Info

Publication number
JPS52168559U
JPS52168559U JP7713676U JP7713676U JPS52168559U JP S52168559 U JPS52168559 U JP S52168559U JP 7713676 U JP7713676 U JP 7713676U JP 7713676 U JP7713676 U JP 7713676U JP S52168559 U JPS52168559 U JP S52168559U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7713676U
Other languages
Japanese (ja)
Other versions
JPS611737Y2 (bg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7713676U priority Critical patent/JPS611737Y2/ja
Publication of JPS52168559U publication Critical patent/JPS52168559U/ja
Application granted granted Critical
Publication of JPS611737Y2 publication Critical patent/JPS611737Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201Structure
    • H01L2224/32012Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad

Landscapes

  • Die Bonding (AREA)
  • Inorganic Insulating Materials (AREA)
JP7713676U 1976-06-15 1976-06-15 Expired JPS611737Y2 (bg)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7713676U JPS611737Y2 (bg) 1976-06-15 1976-06-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7713676U JPS611737Y2 (bg) 1976-06-15 1976-06-15

Publications (2)

Publication Number Publication Date
JPS52168559U true JPS52168559U (bg) 1977-12-21
JPS611737Y2 JPS611737Y2 (bg) 1986-01-21

Family

ID=28552773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7713676U Expired JPS611737Y2 (bg) 1976-06-15 1976-06-15

Country Status (1)

Country Link
JP (1) JPS611737Y2 (bg)

Also Published As

Publication number Publication date
JPS611737Y2 (bg) 1986-01-21

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