JPS5216433Y2 - - Google Patents
Info
- Publication number
- JPS5216433Y2 JPS5216433Y2 JP9045572U JP9045572U JPS5216433Y2 JP S5216433 Y2 JPS5216433 Y2 JP S5216433Y2 JP 9045572 U JP9045572 U JP 9045572U JP 9045572 U JP9045572 U JP 9045572U JP S5216433 Y2 JPS5216433 Y2 JP S5216433Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9045572U JPS5216433Y2 (en:Method) | 1972-08-01 | 1972-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9045572U JPS5216433Y2 (en:Method) | 1972-08-01 | 1972-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4948216U JPS4948216U (en:Method) | 1974-04-26 |
| JPS5216433Y2 true JPS5216433Y2 (en:Method) | 1977-04-13 |
Family
ID=28277937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9045572U Expired JPS5216433Y2 (en:Method) | 1972-08-01 | 1972-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5216433Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7115196B2 (en) | 1998-03-20 | 2006-10-03 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
-
1972
- 1972-08-01 JP JP9045572U patent/JPS5216433Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7144805B2 (en) | 1998-02-04 | 2006-12-05 | Semitool, Inc. | Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density |
| US7115196B2 (en) | 1998-03-20 | 2006-10-03 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
| US7332066B2 (en) | 1998-03-20 | 2008-02-19 | Semitool, Inc. | Apparatus and method for electrochemically depositing metal on a semiconductor workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4948216U (en:Method) | 1974-04-26 |