JPS52153162A - Method and device for connecting substrate - Google Patents

Method and device for connecting substrate

Info

Publication number
JPS52153162A
JPS52153162A JP6969776A JP6969776A JPS52153162A JP S52153162 A JPS52153162 A JP S52153162A JP 6969776 A JP6969776 A JP 6969776A JP 6969776 A JP6969776 A JP 6969776A JP S52153162 A JPS52153162 A JP S52153162A
Authority
JP
Japan
Prior art keywords
connecting substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6969776A
Other languages
Japanese (ja)
Other versions
JPS6033000B2 (en
Inventor
Teruyasu Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP6969776A priority Critical patent/JPS6033000B2/en
Publication of JPS52153162A publication Critical patent/JPS52153162A/en
Publication of JPS6033000B2 publication Critical patent/JPS6033000B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP6969776A 1976-06-16 1976-06-16 Board bonding equipment Expired JPS6033000B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6969776A JPS6033000B2 (en) 1976-06-16 1976-06-16 Board bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6969776A JPS6033000B2 (en) 1976-06-16 1976-06-16 Board bonding equipment

Publications (2)

Publication Number Publication Date
JPS52153162A true JPS52153162A (en) 1977-12-20
JPS6033000B2 JPS6033000B2 (en) 1985-07-31

Family

ID=13410301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6969776A Expired JPS6033000B2 (en) 1976-06-16 1976-06-16 Board bonding equipment

Country Status (1)

Country Link
JP (1) JPS6033000B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor
JPS6261397A (en) * 1985-09-11 1987-03-18 ソニ−ケミカル株式会社 Connecting method for circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58158994A (en) * 1982-03-17 1983-09-21 株式会社日立製作所 Heat soldering method under point and device therefor
JPS6261397A (en) * 1985-09-11 1987-03-18 ソニ−ケミカル株式会社 Connecting method for circuit board

Also Published As

Publication number Publication date
JPS6033000B2 (en) 1985-07-31

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