JPS52153162A - Method and device for connecting substrate - Google Patents
Method and device for connecting substrateInfo
- Publication number
- JPS52153162A JPS52153162A JP6969776A JP6969776A JPS52153162A JP S52153162 A JPS52153162 A JP S52153162A JP 6969776 A JP6969776 A JP 6969776A JP 6969776 A JP6969776 A JP 6969776A JP S52153162 A JPS52153162 A JP S52153162A
- Authority
- JP
- Japan
- Prior art keywords
- connecting substrate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6969776A JPS6033000B2 (en) | 1976-06-16 | 1976-06-16 | Board bonding equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6969776A JPS6033000B2 (en) | 1976-06-16 | 1976-06-16 | Board bonding equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52153162A true JPS52153162A (en) | 1977-12-20 |
JPS6033000B2 JPS6033000B2 (en) | 1985-07-31 |
Family
ID=13410301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6969776A Expired JPS6033000B2 (en) | 1976-06-16 | 1976-06-16 | Board bonding equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6033000B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
JPS6261397A (en) * | 1985-09-11 | 1987-03-18 | ソニ−ケミカル株式会社 | Connecting method for circuit board |
-
1976
- 1976-06-16 JP JP6969776A patent/JPS6033000B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58158994A (en) * | 1982-03-17 | 1983-09-21 | 株式会社日立製作所 | Heat soldering method under point and device therefor |
JPS6261397A (en) * | 1985-09-11 | 1987-03-18 | ソニ−ケミカル株式会社 | Connecting method for circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS6033000B2 (en) | 1985-07-31 |
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