JPS52147262U - - Google Patents
Info
- Publication number
- JPS52147262U JPS52147262U JP1976056041U JP5604176U JPS52147262U JP S52147262 U JPS52147262 U JP S52147262U JP 1976056041 U JP1976056041 U JP 1976056041U JP 5604176 U JP5604176 U JP 5604176U JP S52147262 U JPS52147262 U JP S52147262U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976056041U JPS52147262U (en, 2012) | 1976-04-30 | 1976-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1976056041U JPS52147262U (en, 2012) | 1976-04-30 | 1976-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS52147262U true JPS52147262U (en, 2012) | 1977-11-08 |
Family
ID=28515018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1976056041U Pending JPS52147262U (en, 2012) | 1976-04-30 | 1976-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52147262U (en, 2012) |
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1976
- 1976-04-30 JP JP1976056041U patent/JPS52147262U/ja active Pending