JPS52142965A - Apparatus for wireebonding - Google Patents

Apparatus for wireebonding

Info

Publication number
JPS52142965A
JPS52142965A JP5969076A JP5969076A JPS52142965A JP S52142965 A JPS52142965 A JP S52142965A JP 5969076 A JP5969076 A JP 5969076A JP 5969076 A JP5969076 A JP 5969076A JP S52142965 A JPS52142965 A JP S52142965A
Authority
JP
Japan
Prior art keywords
wireebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5969076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS576695B2 (enrdf_load_html_response
Inventor
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP5969076A priority Critical patent/JPS52142965A/ja
Publication of JPS52142965A publication Critical patent/JPS52142965A/ja
Publication of JPS576695B2 publication Critical patent/JPS576695B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP5969076A 1976-05-25 1976-05-25 Apparatus for wireebonding Granted JPS52142965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5969076A JPS52142965A (en) 1976-05-25 1976-05-25 Apparatus for wireebonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5969076A JPS52142965A (en) 1976-05-25 1976-05-25 Apparatus for wireebonding

Publications (2)

Publication Number Publication Date
JPS52142965A true JPS52142965A (en) 1977-11-29
JPS576695B2 JPS576695B2 (enrdf_load_html_response) 1982-02-06

Family

ID=13120449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5969076A Granted JPS52142965A (en) 1976-05-25 1976-05-25 Apparatus for wireebonding

Country Status (1)

Country Link
JP (1) JPS52142965A (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPS576695B2 (enrdf_load_html_response) 1982-02-06

Similar Documents

Publication Publication Date Title
JPS52138430A (en) Electroomagnetic apparatus
JPS52119555A (en) Hottwater apparatus
AU2521677A (en) Apparatus
JPS53102567A (en) Apparatus for carrying
JPS5351361A (en) Deflectionncompensating apparatus
JPS5367683A (en) Ultraafiltration apparatus
JPS5366672A (en) Apparatus for carrying
IE45498L (en) Slab-gripping apparatus
JPS52124557A (en) Clutchhreleasing apparatus
GB1548026A (en) Ultrafultration apparatus
GB1544568A (en) Pump-calibrating apparatus
JPS5357348A (en) Overloadproof apparatus
GB1553666A (en) Sequence-control apparatus
JPS5330543A (en) Apparatus for preventing waterrsplashing
JPS5295420A (en) Doubleelock apparatus
JPS5354177A (en) Apparatus for eliminating mixeddinnoil
JPS5345070A (en) Cremating apparatus
JPS52135377A (en) Apparatus for presssadhesion
JPS52147256A (en) Overloaddproof apparatus
JPS52107399A (en) Multiifolding apparatus
JPS5353196A (en) Hypnotherapeutic apparatus
JPS52115520A (en) Grounting apparatus
JPS52125761A (en) Apparatus for taking out parts
JPS52116168A (en) Apparatus for wireebonding
JPS5318384A (en) Apparatus for wireebonding