JPS52139762U - - Google Patents

Info

Publication number
JPS52139762U
JPS52139762U JP1976048340U JP4834076U JPS52139762U JP S52139762 U JPS52139762 U JP S52139762U JP 1976048340 U JP1976048340 U JP 1976048340U JP 4834076 U JP4834076 U JP 4834076U JP S52139762 U JPS52139762 U JP S52139762U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976048340U
Other languages
Japanese (ja)
Other versions
JPS5737494Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976048340U priority Critical patent/JPS5737494Y2/ja
Publication of JPS52139762U publication Critical patent/JPS52139762U/ja
Application granted granted Critical
Publication of JPS5737494Y2 publication Critical patent/JPS5737494Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1976048340U 1976-04-16 1976-04-16 Expired JPS5737494Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1976048340U JPS5737494Y2 (https=) 1976-04-16 1976-04-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976048340U JPS5737494Y2 (https=) 1976-04-16 1976-04-16

Publications (2)

Publication Number Publication Date
JPS52139762U true JPS52139762U (https=) 1977-10-22
JPS5737494Y2 JPS5737494Y2 (https=) 1982-08-18

Family

ID=28507550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976048340U Expired JPS5737494Y2 (https=) 1976-04-16 1976-04-16

Country Status (1)

Country Link
JP (1) JPS5737494Y2 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (https=) * 1973-03-10 1974-11-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49131863U (https=) * 1973-03-10 1974-11-13

Also Published As

Publication number Publication date
JPS5737494Y2 (https=) 1982-08-18

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