JPS52135059U - - Google Patents

Info

Publication number
JPS52135059U
JPS52135059U JP1976043356U JP4335676U JPS52135059U JP S52135059 U JPS52135059 U JP S52135059U JP 1976043356 U JP1976043356 U JP 1976043356U JP 4335676 U JP4335676 U JP 4335676U JP S52135059 U JPS52135059 U JP S52135059U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1976043356U
Other languages
Japanese (ja)
Other versions
JPS5645147Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1976043356U priority Critical patent/JPS5645147Y2/ja
Priority to DE2714145A priority patent/DE2714145C2/de
Priority to CA275,206A priority patent/CA1079868A/en
Publication of JPS52135059U publication Critical patent/JPS52135059U/ja
Priority to US06/011,639 priority patent/US4283838A/en
Priority to CA344,749A priority patent/CA1108773A/en
Application granted granted Critical
Publication of JPS5645147Y2 publication Critical patent/JPS5645147Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1976043356U 1976-03-31 1976-04-07 Expired JPS5645147Y2 (enrdf_load_stackoverflow)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP1976043356U JPS5645147Y2 (enrdf_load_stackoverflow) 1976-04-07 1976-04-07
DE2714145A DE2714145C2 (de) 1976-03-31 1977-03-30 Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
CA275,206A CA1079868A (en) 1976-03-31 1977-03-31 Plastic encapsulated semiconductor devices and method of making same
US06/011,639 US4283838A (en) 1976-03-31 1979-02-12 Method of making plastic encapsulated semiconductor devices
CA344,749A CA1108773A (en) 1976-03-31 1980-01-30 Plastic encapsulated semiconductor devices and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1976043356U JPS5645147Y2 (enrdf_load_stackoverflow) 1976-04-07 1976-04-07

Publications (2)

Publication Number Publication Date
JPS52135059U true JPS52135059U (enrdf_load_stackoverflow) 1977-10-14
JPS5645147Y2 JPS5645147Y2 (enrdf_load_stackoverflow) 1981-10-22

Family

ID=28502424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1976043356U Expired JPS5645147Y2 (enrdf_load_stackoverflow) 1976-03-31 1976-04-07

Country Status (1)

Country Link
JP (1) JPS5645147Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5645147Y2 (enrdf_load_stackoverflow) 1981-10-22

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