JPS52134386A - Photo coupled semiconductor device - Google Patents

Photo coupled semiconductor device

Info

Publication number
JPS52134386A
JPS52134386A JP4999676A JP4999676A JPS52134386A JP S52134386 A JPS52134386 A JP S52134386A JP 4999676 A JP4999676 A JP 4999676A JP 4999676 A JP4999676 A JP 4999676A JP S52134386 A JPS52134386 A JP S52134386A
Authority
JP
Japan
Prior art keywords
semiconductor device
coupled semiconductor
photo
photo coupled
transmissin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4999676A
Other languages
Japanese (ja)
Inventor
Tadahiko Mitsuyoshi
Yasutoshi Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4999676A priority Critical patent/JPS52134386A/en
Publication of JPS52134386A publication Critical patent/JPS52134386A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE: A photo coupled semiconductor device such as photo coupler of high light transmissin efficiency and of less false operations owing to stray light is obtained.
COPYRIGHT: (C)1977,JPO&Japio
JP4999676A 1976-05-04 1976-05-04 Photo coupled semiconductor device Pending JPS52134386A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4999676A JPS52134386A (en) 1976-05-04 1976-05-04 Photo coupled semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4999676A JPS52134386A (en) 1976-05-04 1976-05-04 Photo coupled semiconductor device

Publications (1)

Publication Number Publication Date
JPS52134386A true JPS52134386A (en) 1977-11-10

Family

ID=12846608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4999676A Pending JPS52134386A (en) 1976-05-04 1976-05-04 Photo coupled semiconductor device

Country Status (1)

Country Link
JP (1) JPS52134386A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481454U (en) * 1977-11-19 1979-06-09
JPS5481453U (en) * 1977-11-19 1979-06-09

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481454U (en) * 1977-11-19 1979-06-09
JPS5481453U (en) * 1977-11-19 1979-06-09

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